XC7S75-1FGGA676Q Field Programming Gate Array (FPGA) IC Chip 676-BGA

XC7S75-1FGGA676Q Field Programmable Gate Array (FPGA) IC Chip Package 676-BGA

Product Listing: Programmable IC Chip - XC7S75-1FGGA676Q

Product Name: Programmable IC Chip - XC7S75-1FGGA676Q

Product Description: The Programmable IC Chip - XC7S75-1FGGA676Q is a high-performance integrated circuit designed for programmable logic applications. It offers advanced features and capabilities, making it suitable for a wide range of electronic projects and applications.

Product Specifications:

• Model: XC7S75-1FGGA676Q
• Package Type: 676-pin Fine-pitch Ball Grid Array (FGGA676)
• Manufacturer: Xilinx
• Operating Temperature: -40°C to 100°C
• Logic Cells: 75,000
• Maximum User I/O Pins: 350
• Block RAM: 4,860 Kbits
• DSP Slices: 240
• Clock Management Tiles: 6
• JTAG Boundary Scan Support: Yes
• Configuration Memory: Non-volatile Flash
• Power Supply Voltage: 1.2V core voltage, 3.3V I/O voltage

Key Features:

• High-performance programmable logic device
• Fine-pitch Ball Grid Array (FGGA676) package for compact integration
• Abundant logic cells for complex designs
• Extensive I/O pins for versatile connectivity
• Large block RAM for data storage and processing
• Dedicated DSP slices for demanding signal processing tasks
• Multiple clock management tiles for precise timing control
• JTAG boundary scan support for easy debugging and testing
• Non-volatile flash for secure configuration storage
• Wide operating temperature range for various environments
• Low power consumption for energy-efficient designs

Applications:

• High-speed data processing and networking applications
• Digital signal processing and multimedia systems
• Industrial automation and control systems
• Aerospace and defense electronics
• Test and measurement instruments
• Medical devices and equipment
• Telecommunications and networking equipment
• Automotive electronics and infotainment systems

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XC7S75-1FGGA676Q Field Programming Gate Array (FPGA) IC Chip 676-BGA Images