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Brand Name : INTEL/ALTERA
Model Number : 10M04DCU324C8G
Place of Origin : original
MOQ : 1
Price : Negotiable
Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability : 999999
Delivery Time : 1-3 days
Packaging Details : standard
Total RAM Bits : 193536
Voltage - Supply : 1.15V ~ 1.25V
Mounting Type : Surface Mount
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 324-LFBGA
Supplier Device Package : 324-UBGA (15x15)
pn : 10M04DCU324C8G
10M04DCU324C8G Programmable IC Chip
 Field Programmable Gate Array (FPGA) IC 246 193536 4000  Package 324-LFBGA
| Number of LABs/CLBs | 250 |  | 
| Number of Logic Elements/Cells | 4000 |  | 
| Total RAM Bits | 193536 |  | 
| Number of I/O | 246 |  | 
| Voltage - Supply | 1.15V ~ 1.25V |  | 
| Mounting Type |  | |
| Operating Temperature | 0°C ~ 85°C (TJ) |  | 
| Package / Case |  | |
| Supplier Device Package | 324-UBGA (15x15) | 
Intel® Stratix® 10 TX FPGAs feature power-efficient, dual-mode transceivers, capable of both 57.8 Gbps PAM4 (Pulse Amplitude Modulation) and 28.9 Gbps NRZ (Non Return to Zero) operation. Supported by hardened PCI Express Gen 3 and 10/25/100 Gbps Ethernet MAC IP blocks, these devices can deliver over 8 Tbps of aggregate
 bandwidth, meeting the demanding transceiver bandwidth and power budget specifications of next generation designs.
 In addition to the 57.8 Gbps PAM4 / 28.9 Gbps NRZ dual-mode transceivers, Intel Stratix 10 TX devices feature several other breakthrough innovations. These include all new HyperFlex® core architecture, hardened floating point DSP blocks, hardened external memory controllers and advanced packaging technology based on Intel's
 Embedded Multi-die Interconnect Bridge (EMIB).
 With an embedded quad-core 64-bit Arm* Cortex*-A53 hard processor system (HPS) available in select devices, Intel Stratix 10 TX FPGAs deliver power efficient, application-class processing, and allow designers to extend hardware virtualization into the FPGA fabric.
 Intel Stratix 10 TX FPGAs integrate a monolithic 14 nm FPGA fabric die with multiple high-speed transceiver tiles, all inside a single flip-chip BGA package. This implementation, combined with the unmatched transceiver bandwidth and core fabric performance, demonstrates Intel's commitment to deliver high-performance
 programmable solutions to your most challenging system design problems.

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